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The Impact of Hybrid Bonding on Testing 3D-Stacked Dies

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From Interface Chemistry to Bond Wave: Unraveling SiCN/Cu Bonding Mechanisms

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Multiscale Simulation Framework for Predicting Cu-Cu and SiO2-SiO2 Hybrid Bond Quality in Semiconductor Packaging

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Role Of X-Ray Technologies In Device Reliability: From Wafer to Package

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YAP-1.1: Layout-Aware Yield Prediction for 3D Hybrid Bonding>

Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 21-22, 2026 in Silicon Valley. More information below.(23:18 + Q&AS) Prof. Puneet Gupta, EE Department, UCLASummary: As semiconductor ...
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Electromigration Behavior of Hybrid Bonded Cu-Microbumps: Effect of Dielectric, Metal and Interface Properties

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Detection of Physical Damage in Advanced Packaging Interconnects

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T-CPMT Podcast: Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating

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Gerard Hurley, Distinguished Lecturer - High Frequency Magnetics

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Reliability and Yield for Die-to-Wafer Hybrid Bonded 8-High Stacks with TSV>

Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 22-23, 2026 in Silicon Valley. More information below.(25:12 + Q&A) Thomas Workman, Sr Principal Integration Engineer, AdeiaSummary: ...
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Power at the Table - Advocate for Energy & Data Equity: Fireside Chat with Electric Co-Op CEO Curtis Wynn

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Effect of Cu Microstructures on the Thermal Expansion of SiO2 Structures for 3D IC Heterogeneous Integration

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