Researchers from Rice University, University of Utah and National University of Singapore (NUS) published “Three-dimensional ...
Data center AI is driving a dramatic ramp in the growth of silicon photonics foundries: 8X growth in just 6 years, from 2026 ...
Researchers from Fudan University designed a fiber integrated circuit (FIC) with a multilayered spiral architecture. The approach enables the 50-micron-thick fiber to contain 10,000 transistors in a ...
D-IC thermal management & KGD strategies; system-level engineering; within-wafer variability; image segmentation.
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...
Foundry-Enabled Patterning of Diamond Quantum Microchiplets for Scalable Quantum Photonics” was published by researchers at ...
The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.
Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other ...
Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.
A practical, research-supported roadmap, outlining a six-phase path to certification.
A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...
Imec and KU Leuven researchers published “Integration and electrical evaluation of WS2 and MoS2 fets in a 300 mm pilot line.” ...
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