WASHINGTON, Feb 10 (Reuters) - Cadence Design Systems on Tuesday rolled out a virtual artificial intelligence "agent" to help ...

Mike Ellow, CEO of Siemens EDA, outlines the company’s ambitions for AI-powered digital twins that recreate every part of a ...

Researchers at QuTech in Delft, The Netherlands, have developed a new chip architecture that could make it easier to test and ...

Cadence (CDNS) unveiled a virtual AI agent called ChipStack AI Super Agent to help companies accelerate the process of designing computer chips.

OpenAI launches GPT‑5.3‑Codex‑Spark, a Cerebras-powered, ultra-low-latency coding model that claims 15x faster generation ...

Macworld examines a theory suggesting Apple may use 2.5D chip packaging to create a unified M5 Pro and M5 Max design, potentially revolutionizing MacBook Pro architecture. This approach could ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

As demand for data center compute accelerates, power efficiency has become the defining metric for modern CPUs, GPUs, and AI ...

As solar and storage systems scale, power chips are becoming the bottleneck. This design approach aims to remove that limit.

Interior color consultants promise to end homeowners’ paint paralysis and prevent costly mistakes. How do virtual services ...

A new leak suggests Apple’s M5 Pro and M5 Max could be variants of the same chip, enabled by advanced 2.5D packaging.

Intel's 18A process is built around the Backside Power Delivery Network, or BSPDN, a structural overhaul known inside Intel as PowerVia. Instead of routing power through ...