WASHINGTON, Feb 10 (Reuters) - Cadence Design Systems on Tuesday rolled out a virtual artificial intelligence "agent" to help ...

Mike Ellow, CEO of Siemens EDA, outlines the company’s ambitions for AI-powered digital twins that recreate every part of a ...

Researchers led by Assoc. Prof. Dr. Savaş Taşoğlu from the Department of Mechanical Engineering at Koç University have ...

Researchers at QuTech in Delft, The Netherlands, have developed a new chip architecture that could make it easier to test and ...

Cadence (CDNS) unveiled a virtual AI agent called ChipStack AI Super Agent to help companies accelerate the process of designing computer chips.

OpenAI launches GPT‑5.3‑Codex‑Spark, a Cerebras-powered, ultra-low-latency coding model that claims 15x faster generation ...

Macworld examines a theory suggesting Apple may use 2.5D chip packaging to create a unified M5 Pro and M5 Max design, potentially revolutionizing MacBook Pro architecture. This approach could ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

As demand for data center compute accelerates, power efficiency has become the defining metric for modern CPUs, GPUs, and AI ...

A look into the Cornell Custom Silicon Systems project team, one of the only design teams in the country that gives ...

As solar and storage systems scale, power chips are becoming the bottleneck. This design approach aims to remove that limit.

The Maia 200 deployment demonstrates that custom silicon has matured from experimental capability to production ...